Zhaolong Interconnect Participated in the Open Data Center Committee（ODCC）

From September 3 to September 4, the 2024 Open Data Center Conference (ODCC), with the theme of "Enabling New Quality Productivity, Creating a New Era of Computing Power", was held at the Beijing International Convention Center.

As a member and strategic partner of ODCC, Zhaolong Interconnect once again made its appearance at the summit this year, presenting the latest AI & Cloud data center high-speed interconnect solutions:

Server Interconnect

• PCIe 5.0 Riser Cable Assemblies. The self-developed LONGSPEED™ HSC bare wire, whose speed meets the PCIe 5.0 32GT/s standard, supports PCIe 5.0 long-distance applications and provides an overall packaging solution from design to finished products’ shipment. And the PCBA in these cable assemblies can be customized according to clients’ needs. The structural dimensions can also be fully in line with OCSP standards.

  
  

• PCIe x16 to SFF-1020 Gen-z 4C products. Comply with SFF-TA-1002 and SFF-TA-1020 standards and supporting the PCIe® Gen 5.0 standard. Offer cable-to-board and board-to-board applications with 85 ohm differential impedance designs for 30 to 34AWG wire gauges. The small-sized design features a pitch of only 0.6mm. Multiple channels are available - 1C (56pos.), 2C (84pos.), 4C (140pos.) and 4C+ (168pos.).

  
  

• PCIe5.0/6.0 DA-CEM product solutions. Support X16/X32 configuration, with the data rate reaching up to 32/64 GT/s, meeting the requirements of PCIe 5.0/6.0.  Backward compatible with PCIe 4.0/5.0 applications and complies with the standard PCIe® interface specifications. It can be widely applied in data centers, servers, high-performance computing (HPC), GPU and motherboard interconnections, and board and motherboard interconnections.

• CDFP x16 for PCIe5.0 product solutions. Utilizing the self-developed LONGSPEED™ HSC bare wire by Zhaolong, it has low power consumption (maximum 0.125 watts); Complies with the SFF-TA-1032 MSA standard and supports the PCIe® Gen 5.0 standard; The speed per channel meets PCIe 5.0 32GT/s, exceeding the 32GT/channel electrical performance requirements. LSZH products are available in 0.5m-2.0m, 28AWG and 30 AWG.

  
  

• MCIO for PCIe 6.0 product solutions. With the rate supporting the PCI-e 6.0 64 GT/s standard, the solutions’ maximum speed supports 112G PAM4.  Backward compatible with PCI-e 5.0/PCI-e 4.0, support 85-ohm differential impedance designs for 30AWG to 34AWG wire gauges. The structural dimensions are in full compliance with SFF-TA-1016 (MCIO) standards. With miniaturized capsulation, the solutions can be widely applied in servers’ internal transmission.

  
  

• SFF-1016 MCIO connector. With pin distance 0.6mm and85-ohm differential impedance, the connector conforms to the SFF-TA-1016 standard. The SI characteristics meet PCIe 5.0/6.0. Available in 4X (38Pos), 8X (74Pos), 16X (124Pos) Vertical SMT Type; Optional housing’s lengths range from 1.5mm to 4.2mm.

Ethernet High Speed Interconnect

• OSFP1600 (224G*8 Lane) DAC/ACC cable assembly products.  Support eight channels simultaneously, with a single channel at 224G, and the total bandwidth transmission rate reaching 1.6Tb/s (224G PAM4 x 8 Channels); Support 25AWG-32AWG cable gauges.

  
  

• OSFP-XD (112G*16 Lane) 26AWG product solution. Utilizing the LONGSPEED™ Twin-Ax HSC 40-series high-speed bare wire independently developed by Zhaolong, the solution has excellent performance; the solution comply with the OSFP-XD MSA standard and the IEEE 802.3ck specification. The total bandwidth transmission rate can reach 1.6Tb/s and provide DAC/ACC copper cable solutions.

Since 1993, Zhaolong Interconnect has been dedicated to the research, development, and manufacturing of data cables, special cables and connectors.  Continuously providing more reliable, secure, and energy-saving connected product solutions for the green and high-quality development of cloud computing and big data.

Looking forward to the future, Zhaolong  Interconnect will unswervingly commit to research and development and innovation, continuously improve product quality and service levels, and inject a steady stream of power into the new quality productivity of data centers. Joining hands with numerous industry customers and partners in the ODCC working team to jointly create a brilliant chapter in the new era of computing power."